Senior Director R&D - Datacenter Connectivity Silicon (d/m/f) in Pavia, Italia

We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.

• Lead all R&D activities for the product segment, driving innovation and delivering market-leading solutions that enable next-generation data center, optical networking, and AI infrastructure technologies
• Define and execute the product and technology roadmap in close collaboration with Product Management, Business Units, and executive leadership, ensuring alignment with business growth objectives
• Oversee the complete product development lifecycle, from concept and architecture through design, validation, qualification, and successful product release
• Build, lead, and scale world-class multidisciplinary engineering teams across Analog Design, Digital Design, Physical Design, Verification, and Validation
• Drive execution excellence by ensuring products are delivered on time, within budget, and to the highest quality standards
• Partner with cross-functional stakeholders to prioritize investments, allocate resources effectively, and accelerate innovation
• Develop organizational capabilities by coaching engineering leaders, cultivating top talent, and fostering a high-performance, collaborative culture.
• Own R&D resource planning, operational performance, and strategic workforce development for the product segment

• Master's or PhD degree in Electrical Engineering, Microelectronics, or a related field with a focus on Integrated Circuit Design
• 15+ years of experience in semiconductor product development and IC design, including leadership responsibility for complex product portfolios and large engineering organizations
• Proven track record of successfully delivering semiconductor products from concept through high-volume production and market adoption
• Deep expertise in one or more of the following domains: Datacenter & Networking, AI Infrastructure Connectivity, Compute-to-Network Architectures, Optical Interconnects, or High-Speed Communication Technologies
• Demonstrated success leading large multidisciplinary engineering organizations and driving innovation at scale
• Strong knowledge of modern engineering processes, including requirements engineering, verification methodologies, configuration and change management, Design for Robustness (DfR), quality systems, and test development
• Exceptional leadership, communication, and stakeholder management skills with the ability to influence across technical and business functions
• Fluent written and spoken English